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dc.creatorChen, Ruqi
dc.creatorChen, Jason S.
dc.creatorZhang, Chaoqun
dc.creatorKessler, Michael
dc.descriptionThis article is under embargo until December 2, 2015, per publisher policy.en_US
dc.description.abstractSuccessful Michael addition under mild reaction conditions resulted in the grafting of 2-methyl aziridine onto acrylated epoxidized soybean oil, and the aziridine content was titrated as 0.00413 mol g−1. Multiaziridine-containing acrylated epoxidized soybean oil (AESO-AZ) was then subjected to rapid room-temperature polymerization with succinic acid, citric acid, and an isosorbide-based diacid, respectively. The polyacids were added to AESO-AZ at stoichiometric ratios. The resulting polymeric materials were cast into films in order to investigate their thermo-mechanical properties. Differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA), thermogravimetric analysis (TGA), and tensile stress–strain tests were performed. The glass transition temperatures (Tg) of the samples suggested that increased functionality of the carboxylic acid groups in the polyacids may have effectively increased Tg, while the rigid rings in isosorbide did not have significant impact on Tg. This work illustrates the feasibility of synthesizing bio-based multiaziridine-containing compounds that can be used as the monomer for rapid polymerization with bio-based polyacids at ambient temperature.en_US
dc.publisherRSC Advances
dc.rightsCreative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
dc.subjectSustainable engineering
dc.subjectBio-based multiaziridine-containing compounds
dc.subjectPolymer Sciences
dc.titleRapid room-temperature polymerization of bio-based multiaziridine-containing compounds
dc.description.citationR. Chen, J. S. Chen, C. Zhang, M. R. Kessler: Rapid Room-temperature Polymerization of Bio-based Multiaziridine-containing Compounds, RSC Advances, 2015, 5(2), 1557-1563. DOI: 10.1039/C4RA10335A.

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  • Kessler, Michael
    This collection features research by Michael Kessler, professor in the School of Mechanical and Materials Engineering at Washington State University.

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Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International
Except where otherwise noted, this item's license is described as Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International